Tantalum pentoxide sputtering target (ti doped), diam. × thickness 152.4 mm x 6.4 mm with indium bonded 0.2 mm copper backing plate diam. x thickness 140 mm × 15 mm, 99.95%
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About Tantalum pentoxide sputtering target (ti doped), diam. × thickness 152.4 mm x 6.4 mm with indium bonded 0.2 mm copper backing plate diam. x thickness 140 mm × 15 mm, 99.95%
Tantalum pentoxide sputtering target (ti doped), diam. × thickness 152.4 mm x 6.4 mm with indium bonded 0.2 mm copper backing plate diam. x thickness 140 mm × 15 mm, 99.95% sits in our sputtering Targets & Evaporation Materials section and ships worldwide from stock or short lead time.
Typical applications
- PVD & sputter coating
- Thin-film deposition
- Semiconductor fabrication
Handling and storage
No GHS classification is recorded for this item, but handle it with normal laboratory care.
Standard pack sizes are 1 pc, and custom quantities are quoted on request. You receive a batch certificate of analysis and a 16-section SDS with each order. Add it to your quote list and our team replies with price, lead time and shipping options within one business day.
Typical uses
- PVD & sputter coating
- Thin-film deposition
- Semiconductor fabrication
Applications
Specifications and identifiers
| Product name | Tantalum pentoxide sputtering target (ti doped), diam. × thickness 152.4 mm x 6.4 mm with indium bonded 0.2 mm copper backing plate diam. x thickness 140 mm × 15 mm, 99.95% |
|---|---|
| Catalogue number | ZX-016300 |
| Purity / assay | 99.95% |
| Physical form | Solid |
| Appearance | Solid |
| HS code | 81129090 |
Lot values are stated on the batch certificate of analysis. Ask for a typical COA with your quotation.
Safety and GHS hazards
No GHS classification is on file for this item. Handle it as an unknown laboratory chemical and request the SDS with your quotation.
Pack sizes
| 1 pc | Quoted on request |
Need a different size? Bulk drums and custom packing are quoted on request through the quote form on this page.
Questions about Tantalum pentoxide sputtering target (ti doped), diam. × thickness 152.4 mm x 6.4 mm with indium bonded 0.2 mm copper backing plate diam. x thickness 140 mm × 15 mm, 99.95%
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