Application

Chemicals for electronics, PCB and semiconductors

High-purity acids, etchants, cleaning solvents, photoresist solvents and specialty metals for electronics assembly, display and semiconductor work.

2,154 mapped products Typical chemicals

Products used in electronics, PCB and semiconductors

169–192 of 2,154 products

Bismuth sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016105

Bismuth sputtering target, diam. x thickness 25.4 mm x 10 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016106

Bismuth sputtering target, diam. x thickness 25.4 mm x 5 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016107

Bismuth(III) selenide, - 350 mesh, 99.99%

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-017402

Bismuth(III) telluride, - 350 mesh, 99.99%

CAS: 1304-82-1
Formula: Bi₂Te₃
MW: 800.76 g/mol

ZX-017403

Bismuth(III) telluride, 99.98%

CAS: 1304-82-1
Formula: Bi₂Te₃
MW: 800.76 g/mol

ZX-017404

BK7 glass substrates, 20 mm dia, 3 mm thick

ZX-017047

BK7 glass substrates, 25 mm dia, 1 mm thick

ZX-017048

BK7 glass substrates, 25 mm dia, 3 mm thick

ZX-017049

BK7 glass substrates, 25.4 mm dia, 1 mm thick

ZX-017050

BK7 glass substrates, 50 mm dia, 1 mm thick

ZX-017051

BK7 glass substrates, 50.8 mm dia, 1 mm thick

ZX-017052

Boric acid, 99.97%

CAS: 10043-35-3
Formula: BH₃O₃
MW: 61.84 g/mol

ZX-017405

Boric acid, 99.999%

CAS: 10043-35-3
Formula: BH₃O₃
MW: 61.84 g/mol

ZX-017406

Boric acid, 99.9995%

CAS: 10043-35-3
Formula: BH₃O₃
MW: 61.84 g/mol

ZX-017407

Boron foil, thick 2 mm, 99%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-015353

Boron nanopowder, APS 80-100 nm, 99.9%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016369

Boron nanopowder, APS 80-100 nm, 99%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016368

Boron silicide, 200 mesh, 98%

CAS: 12008-29-6
Formula: B₆Si
MW: 93 g/mol

ZX-017408

Boron sputtering target bonded with Indium (In) dia x thickness 2 inch × 3 mm, ≥99.9%

ZX-016108

Boron sputtering target, 25 mm x 25 mm x 2 mm th., ≥99.5%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016109

Boron sputtering target, diam. x thickness 30 mm × 10 mm, ≥99.9%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016110

Boron sputtering target, diam. x thickness 4 inch × 3 mm, ≥99.9%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016111

Boron sputtering target, diam. x thickness 76.2 mm × 3.18 mm, ≥99.95%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016112

Questions

Buying for electronics, PCB and semiconductors

What container types do high-purity acids ship in?

Electronic grade acids are filled into pre-cleaned HDPE or PFA bottles and drums so the container does not leach metals into the product. Bottle size and closure type affect cleanliness, so state your preferred pack when you request a quote.

Can I get a lot-specific trace metal report?

Yes. For electronic grade material the COA reports measured values for each specified element, usually by ICP-MS, rather than a generic statement of compliance. Ask for the full element list if your process is sensitive to a metal that is not routinely reported.

Do you supply sputtering targets or only chemicals?

Our focus is chemicals and high-purity metals in powder, granule or ingot form. Indium tin oxide and some metals can be supplied as powders or pieces for target fabrication. Finished bonded targets are quoted on request through specialist producers.

Other applications

Pharmaceutical Manufacturing and QC Agrochemicals and Crop Protection Water and Wastewater Treatment Paints, Coatings and Inks Textiles, Dyes and Leather Food, Beverage and Nutrition Cosmetics and Personal Care Research Labs and Universities Oil, Gas and Petrochemicals Polymers, Plastics and Rubber Batteries and Energy Storage Mining, Mineral Processing and Metallurgy Diagnostics, Life Science and Biotech