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Optical Windows & Coated Substrates

Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm

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Order Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm (CAS 7440-21-3) online at Zemixal…

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Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm chemical structure
CAS number7440-21-3
FormulaSi
Molar mass28.09 g/mol
Physical formSolid
HS code9002
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
IUPAC namesilicon

About Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm

Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is part of the Zemixal optical Windows & Coated Substrates range. Identity at a glance: CAS 7440-21-3, formula Si and molar mass 28.09 g/mol. It is handled as a solid.

Typical applications

  • Optical windows
  • IR & UV optics
  • Coated substrates
  • Electronics & thin films

Handling and storage

Classified under GHS with signal word Danger and hazard statements H228 and H320. Read the SDS before first use.

Order it in 1 pc, 10 pc and 100 pc packs or ask for a bulk quotation. Every shipment includes a batch certificate of analysis and a 16-section SDS. Request pricing online and we confirm availability, documentation and freight to your country.

Typical uses

  • Optical windows
  • IR & UV optics
  • Coated substrates
  • Electronics & thin films

Applications

Specifications and identifiers

Specifications of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
Product nameSilicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
Catalogue numberZX-017166
CAS number7440-21-3
IUPAC namesilicon
Molecular formulaSi
Molar mass28.09 g/mol
Exact mass27.9769
Physical formSolid
H-bond donors / acceptors0 / 0
Topological polar surface area0 Ų
HS code9002
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
SMILES[Si]
PubChem CID5461123

Lot values are stated on the batch certificate of analysis. Ask for a typical COA with your quotation.

Safety and GHS hazards

GHS02 Flammable
Flammable

Signal word Danger

  • H228Flammable solid
  • H320Causes eye irritation

Precautionary statements P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378

Classification summarised from public GHS notifications. It can vary with grade and concentration, so always follow the SDS supplied with your lot.

Pack sizes

Pack sizes of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
1 pcQuoted on request
10 pcQuoted on request
100 pcQuoted on request

Need a different size? Bulk drums and custom packing are quoted on request through the quote form on this page.

Questions about Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm

Which CAS number identifies Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is registered under CAS 7440-21-3. Our catalogue number for this item is ZX-017166.
What are the formula and molar mass of Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
For Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm, its formula is Si and its molar mass is 28.09 g/mol. The systematic (IUPAC) name is silicon. InChIKey XUIMIQQOPSSXEZ-UHFFFAOYSA-N lets you match it in any structure database.
What grade and pack sizes are available for Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
The grade and assay are confirmed on the quotation and the batch COA. Standard packs are 1 pc, 10 pc, 100 pc. Larger quantities and custom packing can be quoted on request.
Which documents come with Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm?
Each lot ships with a batch certificate of analysis and a 16-section GHS safety data sheet. A typical COA or specification sheet can be shared with the quotation before you order.
Can Zemixal ship Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm to my country?
Yes. Because Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm is classed as hazardous, it travels in UN-approved packaging as dangerous goods under IATA or IMDG rules, with the export paperwork your broker needs.

Other grades with CAS 7440-21-3

All 21 grades

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