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Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm

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Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm (CAS 7440-21-3) supplier Zemixal…

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Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm chemical structure
CAS number7440-21-3
FormulaSi
Molar mass28.09 g/mol
Physical formSolid
HS code9002
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
IUPAC namesilicon

About Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm

Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm sits in our optical Windows & Coated Substrates section and ships worldwide from stock or short lead time. Identity at a glance: CAS 7440-21-3, formula Si and molar mass 28.09 g/mol. It is handled as a solid.

Common uses in the lab and plant

  • Optical windows
  • IR & UV optics
  • Coated substrates
  • Electronics & thin films

Storage and safety notes

Hazard communication follows GHS (Danger: H228 and H320). Our SDS lists exposure controls and first-aid measures.

Available as 1 pc and 10 pc. Larger or split packs can be arranged. Each lot travels with a batch certificate of analysis and a 16-section SDS. Request pricing online and we confirm availability, documentation and freight to your country.

Typical uses

  • Optical windows
  • IR & UV optics
  • Coated substrates
  • Electronics & thin films

Applications

Specifications and identifiers

Specifications of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
Product nameSilicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
Catalogue numberZX-017179
CAS number7440-21-3
IUPAC namesilicon
Molecular formulaSi
Molar mass28.09 g/mol
Exact mass27.9769
Physical formSolid
H-bond donors / acceptors0 / 0
Topological polar surface area0 Ų
HS code9002
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
SMILES[Si]
PubChem CID5461123

Lot values are stated on the batch certificate of analysis. Ask for a typical COA with your quotation.

Safety and GHS hazards

GHS02 Flammable
Flammable

Signal word Danger

  • H228Flammable solid
  • H320Causes eye irritation

Precautionary statements P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378

Classification summarised from public GHS notifications. It can vary with grade and concentration, so always follow the SDS supplied with your lot.

Pack sizes

Pack sizes of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm
1 pcQuoted on request
10 pcQuoted on request

Need a different size? Bulk drums and custom packing are quoted on request through the quote form on this page.

Questions about Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm

Which CAS number identifies Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm?
Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm is registered under CAS 7440-21-3. Our catalogue number for this item is ZX-017179.
What are the formula and molar mass of Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm?
For Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm, its formula is Si and its molar mass is 28.09 g/mol. The systematic (IUPAC) name is silicon. InChIKey XUIMIQQOPSSXEZ-UHFFFAOYSA-N lets you match it in any structure database.
What grade and pack sizes are available for Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm?
The grade and assay are confirmed on the quotation and the batch COA. Standard packs are 1 pc, 10 pc. Larger quantities and custom packing can be quoted on request.
Which documents come with Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm?
Each lot ships with a batch certificate of analysis and a 16-section GHS safety data sheet. A typical COA or specification sheet can be shared with the quotation before you order.
Can Zemixal ship Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm to my country?
Yes. Because Silicon wafer, P-type, contains boron as dopant, diam. × thickness 2 in x 250 μm is classed as hazardous, it travels in UN-approved packaging as dangerous goods under IATA or IMDG rules, with the export paperwork your broker needs.

Other grades with CAS 7440-21-3

All 21 grades

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