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Single Crystal Substrates & Wafers

Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm

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Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm (CAS 7440-21-3) supplier Zemixal…

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Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm chemical structure
CAS number7440-21-3
FormulaSi
Molar mass28.09 g/mol
Physical formSolid
HS code90019090
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
IUPAC namesilicon

About Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm

Researchers and plant chemists source Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm from Zemixal for routine and specialised work. Key data: CAS 7440-21-3, formula Si and molar mass 28.09 g/mol. It is handled as a solid.

Use cases we see most often

  • Epitaxial thin-film growth
  • Semiconductor research
  • Substrate for devices
  • Electronics & thin films

Storage and safety notes

Reported physical data: boiling point 2355 °C. Classified under GHS with signal word Danger and hazard statements H228 and H320. Read the SDS before first use.

Standard pack sizes are 1 pc and 10 pc, and custom quantities are quoted on request. Each lot travels with a batch certificate of analysis and a 16-section SDS. Add it to your quote list and our team replies with price, lead time and shipping options within one business day.

Typical uses

  • Epitaxial thin-film growth
  • Semiconductor research
  • Substrate for devices
  • Electronics & thin films

Applications

Specifications and identifiers

Specifications of Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm
Product nameSilicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm
Catalogue numberZX-017364
CAS number7440-21-3
IUPAC namesilicon
Molecular formulaSi
Molar mass28.09 g/mol
Exact mass27.9769
Physical formSolid
Boiling point2355 °C
H-bond donors / acceptors0 / 0
Topological polar surface area0 Ų
HS code90019090
InChIKeyXUIMIQQOPSSXEZ-UHFFFAOYSA-N
SMILES[Si]
PubChem CID5461123

Lot values are stated on the batch certificate of analysis. Ask for a typical COA with your quotation.

Safety and GHS hazards

GHS02 Flammable
Flammable

Signal word Danger

  • H228Flammable solid
  • H320Causes eye irritation

Precautionary statements P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378

Classification summarised from public GHS notifications. It can vary with grade and concentration, so always follow the SDS supplied with your lot.

Pack sizes

Pack sizes of Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm
1 pcQuoted on request
10 pcQuoted on request

Need a different size? Bulk drums and custom packing are quoted on request through the quote form on this page.

Questions about Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm

Which CAS number identifies Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm?
Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm is registered under CAS 7440-21-3. Our catalogue number for this item is ZX-017364.
What are the formula and molar mass of Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm?
For Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm, its formula is Si and its molar mass is 28.09 g/mol. The systematic (IUPAC) name is silicon. InChIKey XUIMIQQOPSSXEZ-UHFFFAOYSA-N lets you match it in any structure database.
What grade and pack sizes are available for Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm?
The grade and assay are confirmed on the quotation and the batch COA. Standard packs are 1 pc, 10 pc. Larger quantities and custom packing can be quoted on request.
Which documents come with Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm?
Each lot ships with a batch certificate of analysis and a 16-section GHS safety data sheet. A typical COA or specification sheet can be shared with the quotation before you order.
Can Zemixal ship Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm to my country?
Yes. Because Silicon wafer (single substrase), p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm is classed as hazardous, it travels in UN-approved packaging as dangerous goods under IATA or IMDG rules, with the export paperwork your broker needs.

Other grades with CAS 7440-21-3

All 21 grades

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