Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
Buy Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm (CAS 7440-21-3) from Zemixal…
About Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm is part of the Zemixal single Crystal Substrates & Wafers range. For your records, the material is defined by CAS 7440-21-3, formula Si and molar mass 28.09 g/mol. It is handled as a solid.
Use cases we see most often
- Epitaxial thin-film growth
- Semiconductor research
- Substrate for devices
- Electronics & thin films
Safe handling
Physical constants on file: boiling point 2355 °C. Hazard communication follows GHS (Danger: H228 and H320). Our SDS lists exposure controls and first-aid measures.
Order it in 1 pc and 10 pc packs or ask for a bulk quotation. Each lot travels with a batch certificate of analysis and a 16-section SDS. Request pricing online and we confirm availability, documentation and freight to your country.
Typical uses
- Epitaxial thin-film growth
- Semiconductor research
- Substrate for devices
- Electronics & thin films
Applications
Specifications and identifiers
| Product name | Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm |
|---|---|
| Catalogue number | ZX-017362 |
| CAS number | 7440-21-3 |
| IUPAC name | silicon |
| Molecular formula | Si |
| Molar mass | 28.09 g/mol |
| Exact mass | 27.9769 |
| Physical form | Solid |
| Boiling point | 2355 °C |
| H-bond donors / acceptors | 0 / 0 |
| Topological polar surface area | 0 Ų |
| HS code | 90019002 |
| InChIKey | XUIMIQQOPSSXEZ-UHFFFAOYSA-N |
| SMILES | [Si] |
| PubChem CID | 5461123 |
Lot values are stated on the batch certificate of analysis. Ask for a typical COA with your quotation.
Safety and GHS hazards
Signal word Danger
- H228Flammable solid
- H320Causes eye irritation
Precautionary statements P210, P240, P241, P264 + P265, P280, P305 + P351 + P338, P337 + P317, P370 + P378
Classification summarised from public GHS notifications. It can vary with grade and concentration, so always follow the SDS supplied with your lot.
Pack sizes
| 1 pc | Quoted on request | |
| 10 pc | Quoted on request |
Need a different size? Bulk drums and custom packing are quoted on request through the quote form on this page.
Questions about Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
Which CAS number identifies Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm?
What are the formula and molar mass of Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm?
What grade and pack sizes are available for Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm?
Which documents come with Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm?
Can Zemixal ship Silicon wafer (single substrase), p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm to my country?
Other grades with CAS 7440-21-3
All 21 grades- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
Related products
More in Single Crystal Substrates & Wafers- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
Have a list of compounds to price?
Paste up to 200 CAS numbers into Bulk CAS lookup, or send one enquiry for everything in your quote list. We reply with price, lead time and documents.