Silicon optical (mono crystalline) windows, 90 mm dia, 20 mm thick, 99.999%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017157
Application
Chemicals for electronics, PCB and semiconductors
High-purity acids, etchants, cleaning solvents, photoresist solvents and specialty metals for electronics assembly, display and semiconductor work.
Products used in electronics, PCB and semiconductors
1,609–1,632 of 2,154 products
Silicon optical, mono crystalline, windows, 90 mm dia, 10 mm thick, 99.999%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017158
Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016288
Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016290
Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016291
Silicon sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016289
Silicon substrate (single side polished), P-type, diam. × thickness 1 in. × 300 - 400 μm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017159
Silicon substrate (single side polished), P-type, diam. × thickness 2 in. × 300 - 400 μm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017160
Silicon substrate, single side polished, 10 mm x 10 mm x 1 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017161
Silicon substrate, single side polished, P-type, contains boron as dopant, diam. × thickness 25 mm × 1 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017162
Silicon substrate, single side polished, P-type, contains boron as dopant, diam. × thickness 50 mm × 1 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017163
Silicon wafer (double side polished), Intrinsic, dia x thickness 100 mm x 500 µm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017165
Silicon wafer (double side polished), Intrinsic, dia x thickness 150 mm x 625 µm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017166
Silicon wafer (single side polished), diam. × thickness 50.8 mm × 0.3 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017167
Silicon wafer (single side polished), N (Phosphorous doped), diam. x thickness 50.8 mm x 280 μm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017168
Silicon wafer (single side polished), N (Phosphorous doped), diam. x thickness 76 mm x 380 μm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017169
Silicon wafer (single side polished), N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.275 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017170
Silicon wafer (single side polished), N-type, contains phosphorus as dopant, diam. x thickness 2 in. x 0.5 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017171
Silicon wafer (single side polished), N-type, diam. x thickness 4 in x 0.525 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017172
Silicon wafer (single side polished), P-type, contains boron as dopant, diam. × thickness 2 in. x 0.5 mm
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-017174
Questions
Buying for electronics, PCB and semiconductors
What container types do high-purity acids ship in?
Electronic grade acids are filled into pre-cleaned HDPE or PFA bottles and drums so the container does not leach metals into the product. Bottle size and closure type affect cleanliness, so state your preferred pack when you request a quote.
Can I get a lot-specific trace metal report?
Yes. For electronic grade material the COA reports measured values for each specified element, usually by ICP-MS, rather than a generic statement of compliance. Ask for the full element list if your process is sensitive to a metal that is not routinely reported.
Do you supply sputtering targets or only chemicals?
Our focus is chemicals and high-purity metals in powder, granule or ingot form. Indium tin oxide and some metals can be supplied as powders or pieces for target fabrication. Finished bonded targets are quoted on request through specialist producers.
Other applications
Pharmaceutical Manufacturing and QCAgrochemicals and Crop ProtectionWater and Wastewater TreatmentPaints, Coatings and InksTextiles, Dyes and LeatherFood, Beverage and NutritionCosmetics and Personal CareResearch Labs and UniversitiesOil, Gas and PetrochemicalsPolymers, Plastics and RubberBatteries and Energy StorageMining, Mineral Processing and MetallurgyDiagnostics, Life Science and Biotech