Metals & Alloys

Sputtering Targets & Evaporation Materials

Metal, oxide and alloy sputtering targets plus evaporation pellets and pieces in standard and custom sizes for thin-film deposition.

285 productsCOA + SDS with every lot

285 products · page 2 of 12

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Bismuth selenide doped with manganese, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Mn)

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016099

Bismuth selenide doped with nickel, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Ni)

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016100

Bismuth selenide doped with nickel, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Ni)

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016101

Bismuth selenide, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95%

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016102

Bismuth selenide, sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016103

Bismuth selenide, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95%

CAS: 12068-69-8
Formula: Bi₂Se₃
MW: 654.84 g/mol

ZX-016104

Bismuth sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016105

Bismuth sputtering target, diam. x thickness 25.4 mm x 10 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016106

Bismuth sputtering target, diam. x thickness 25.4 mm x 5 mm, 99.9%

CAS: 7440-69-9
Formula: Bi
MW: 208.98 g/mol

ZX-016107

Boron sputtering target bonded with Indium (In) dia x thickness 2 inch × 3 mm, ≥99.9%

ZX-016108

Boron sputtering target, 25 mm x 25 mm x 2 mm th., ≥99.5%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016109

Boron sputtering target, diam. x thickness 30 mm × 10 mm, ≥99.9%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016110

Boron sputtering target, diam. x thickness 4 inch × 3 mm, ≥99.9%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016111

Boron sputtering target, diam. x thickness 76.2 mm × 3.18 mm, ≥99.95%

CAS: 7440-42-8
Formula: B
MW: 10.81 g/mol

ZX-016112

Chromium pieces, 1-3 mm, 99.9%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016113

Chromium pieces, 1-3 mm, 99.99%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016114

Chromium sputtering target, 200 mm x 125 mm x 3 mm with indium bonded 0.2 mm copper backing plate thickness 2 mm, 99.99%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016115

Chromium sputtering target, diam x thickness 2 inch × 0.25 inch, ≥99.95%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016116

Chromium sputtering target, diam x thickness 2 inch × 1.5 mm, ≥99.95%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016117

Chromium sputtering target, diam. × thickness 2 inch × 3 mm, 99.9%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016119

Chromium sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016120

Chromium sputtering target, diam. × thickness 3 inch × 2 mm, 99.95%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016121

Chromium sputtering target, diam. × thickness 3 inch × 6 mm, 99.95%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016122

Chromium sputtering target, diam. × thickness 50 mm × 5 mm, 99.99%

CAS: 7440-47-3
Formula: Cr
MW: 52 g/mol

ZX-016123

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