Platinum sputtering target, diam. × thickness 2 inch × 0.7 mm, 99.99%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
ZX-016267
Metals & Alloys
Sputtering Targets & Evaporation Materials
Metal, oxide and alloy sputtering targets plus evaporation pellets and pieces in standard and custom sizes for thin-film deposition.
Platinum sputtering target, diam. × thickness 57 mm × 0.1 mm, 99.9%
- CAS
- 7440-06-4
- Formula
- Pt
- MW
- 195.08 g/mol
ZX-016268
Praseodymium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
- CAS
- 7440-10-0
- Formula
- Pr
- MW
- 140.91 g/mol
ZX-016269
Ruthenium sputtering target, diam. x thickness 1 inch × 3 mm, ≥99.99%
- CAS
- 7440-18-8
- Formula
- Ru
- MW
- 101.1 g/mol
ZX-016270
Ruthenium sputtering target, diam. x thickness 2 inch × 1 mm, ≥99.9%
- CAS
- 7440-18-8
- Formula
- Ru
- MW
- 101.1 g/mol
ZX-016271
Ruthenium sputtering target, diam. x thickness 2 inch × 2 mm, ≥99.9%
- CAS
- 7440-18-8
- Formula
- Ru
- MW
- 101.1 g/mol
ZX-016272
Ruthenium sputtering target, diam. x thickness 3 inch × 1 mm, ≥99.95%
- CAS
- 7440-18-8
- Formula
- Ru
- MW
- 101.1 g/mol
ZX-016273
Ruthenium sputtering target, diam. x thickness 3 inch × 2 mm, ≥99.95%
- CAS
- 7440-18-8
- Formula
- Ru
- MW
- 101.1 g/mol
ZX-016274
Scandium sputtering target, diam. x thickness 14 inch x 0.25 inch, 99.99%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016276
Scandium sputtering target, diam. x thickness 164 mm x 6 mm, 99.99%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016277
Scandium sputtering target, diam. x thickness 2 inch x 0.125 inch, 99.995%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016278
Scandium sputtering target, diam. x thickness 2 inch x 0.25 inch, 99.99%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016279
Scandium sputtering target, diam. x thickness 3 inch x 0.125 inch, 99.99%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016280
Scandium sputtering target, diam. x thickness 3 inch x 0.25 inch, 99.99%
- CAS
- 7440-20-2
- Formula
- Sc
- MW
- 44.96 g/mol
ZX-016281
Silicon carbide sputtering target, diam. x thickness 4 inch x 6 mm, 99.5%
- CAS
- 409-21-2
- Formula
- CSi
- MW
- 40.1 g/mol
ZX-016282
Silicon dioxide sputtering target, diam. x thickness 304.8 mm x 10 mm, 99.99% elastomer bonding to Copper backing plate 304.8mm dia x 16 mm thick
- CAS
- 14808-60-7
- Formula
- O2Si
- MW
- 60.08 g/mol
ZX-016286
Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016288
Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016290
Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99%
- CAS
- 7440-21-3
- Formula
- Si
- MW
- 28.09 g/mol
ZX-016291
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